Sponsored Content: Accelerating Failure Analysis Workflows at Scale
As semiconductor devices continue to grow in size and complexity, failure analysis workflows face increasing pressure to deliver results faster. Meeting those demands becomes more difficult when sample preparation and downstream analysis compete for the same resources, leading to reduced throughput, lower utilization of valuable analytical tools and longer time-to-result.
Mechanical polishing can affect specimen integrity, while FIB-based preparation is often too slow and costly for large-area processing. Integrated preparation and analysis platforms can create capacity bottlenecks because only one function can operate at a time, limiting workflow efficiency.
3D-Micromac’s microPREP® L addresses these workflow challenges. The dedicated laser sample-preparation platform enables fast, precise material removal for semiconductor samples ranging from individual dies to full 300-mm wafers and system-level boards. It supports multiple regions of interest within a single workflow while reducing manual handling and preparation steps, helping improve throughput and accelerate time-to-result. Selective laser ablation enables localized material removal without destroying or damaging the regions of interest.
Maximizing Workflow Efficiency
By offloading high-speed material removal from downstream analytical tools, microPREP® L enables FIB and other analytical systems to focus on the tasks they were designed to perform. Open compatibility with downstream platforms also gives semiconductor labs the flexibility to optimize workflows around their existing equipment and application requirements.
From R&D to Production
microPREP® L supports failure analysis, quality assurance and process development, making it ideal for both R&D labs and semiconductor production environments. Automation-ready configurations enable customers to tailor the platform to their specific applications and manufacturing environments.
More Than 25 Years of Industry Expertise
Researchers and engineers also benefit from 3D-Micromac’s 25+ years of laser expertise and more than a decade of field-proven microPREP® technology. The company works closely with customers to address unique applications and workflow requirements, helping them optimize throughput, utilization and productivity. This combination of proven technology, application expertise and collaborative support helps customers address today’s most demanding semiconductor sample-preparation challenges.
Meet 3D-Micromac at IMC – Booth 328
Visit 3D-Micromac at IMC to learn how microPREP® L can help optimize semiconductor failure analysis, quality assurance and process development workflows. Attendees can discuss their specific applications with the 3D-Micromac team and learn how the platform can be configured to support their production and analytical requirements.
For more information, contact us at sales@3d-micromac.com or find out more online.